Paul Alcorn, Tom’s Hardware, Inside Intel’s CPU Packaging Factory: From Wafer to Chip

“Intel and TSMC are competing furiously to provide the most advanced packaging technologies available, and Intel’s Malaysia facilities play a key role in its efforts as it looks to ramp up its Meteor Lake production, a new series of consumer CPUs that employ groundbreaking production techniques. “


Digitally distracted professor. Researcher/author on Islam, Muslims and the internet. Emoji-free zone. Reposting does not imply endorsement, etc. #HashtagIslam #Islam