Paul Alcorn, Tom’s Hardware, Inside Intel’s CPU Packaging Factory: From Wafer to Chip “Intel and TSMC are competing furiously to provide the most advanced packaging technologies available, and Intel’s...
Damilare Dosunmu, Rest of World, Stifled at home, Tunisian tech finds success in the West, 9 Aug 2023 “Acquisitions of InstaDeep and Expensya, which focused on international customers, are...
Aisling Ní Chúláin & Reuters/Euronews, This 13-year old Egyptian wunderkind is building his own metaverse out of his mother’s old clothes, 28 June 2022 “Using some of his mother’s...